Cassette Multi-Tray is a standard for packaging and transporting integrated circuits (ICs) in multi-tray cassettes. A multi-tray cassette is a plastic container that is divided into multiple trays, each of which holds a specific number of ICs in a specific configuration. The Cassette Multi-Tray standard is defined by the JEDEC, Joint Electron Device Engineering Council, an industry group that sets standards for the semiconductor industry.

The Cassette Multi-Tray standard is widely used in the semiconductor industry for shipping and handling ICs between manufacturing facilities, testing facilities, and customers. It ensures that ICs are packaged and handled in a way that protects them from damage and contamination during transport. The trays are designed to hold the ICs securely in place, and they are often sealed to protect the ICs from dust and other contaminants.

The Cassette Multi-Tray standard is a cost-effective and efficient way to package and transport ICs. The multi-tray cassette is stackable, which makes them easy to store and transport. The standard dimensions of the cassette make them easy to handle and load into shipping containers, which reduces the risk of damage to the ICs. Additionally, the cassette are reusable, which makes them an environmentally friendly option for packaging and transport.

The standard is also flexible, as it offers multiple cassette sizes and configurations to suit different IC types and quantities. The cassette are also designed to be compatible with standard automated handling equipment, which helps to streamline the manufacturing process. This can help reduce costs and improve efficiency.

One of the advantages of Cassette Multi-Tray is that it can hold multiple trays, this is useful for shipping a large number of ICs together, reducing the number of packages, and also it can help to protect them better, as the trays are inside a sealed container.

In conclusion, Cassette Multi-Tray is an industry standard that offers a cost-effective, efficient, and environmentally friendly way to package and transport integrated circuits. It provides a consistent way to handle ICs and it also helps to protect them from damage and contamination during transport, providing a convenient and secure method for the semiconductor industry.